- Buyer
- University of Strathclyde
- Deadline
- Closed Sep 7 · 29 days ago
- Posted
- Aug 3, 2026
- Location
- UKM82 · United Kingdom
- Category
- Construction & facilities
- Type
- Open procedure · goods
- Notice ID
- AUG561507
- Source
- Public Contracts Scotland
Description
Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a require
What BidRover found in this bid
- Requirements extractedpending review
- Source documents read1 files
- Fit score for your businessworkspace only
- Bid / no-bid briefworkspace only
Create a free account to save this search and get weekly alerts. Requirements, document reading, fit scores and team review are part of the paid workspace.
BidRover copies listing details from Public Contracts Scotland. Always confirm requirements, amendments and submission instructions in the official notice before responding.